Hamburg 2016 – scientific programme

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T: Fachverband Teilchenphysik

T 96: Halbleiterdetektoren V (DEPFET)

T 96.8: Talk

Thursday, March 3, 2016, 18:30–18:45, VMP8 HS

JTAG Boundary-Scan of the Belle II Pixel Vertex Detector — •Philipp Leitl for the Belle II collaboration — Max-Planck-Institut für Physik

For the upgrade of the Vertex Detector at the Belle II experiment, DEPFET sensors will be used. This new technology requires specific electronics for controlling and readout. Therefore three different kinds of Application-Specific Integrated Circuits (ASICs) are mounted very close to the sensors. Because of space limitations ball grid arrays (BGAs) are used for the contacts to the electronic circuitry.

After the mounting process this results in a lack of physical access to the electrical connections. With Boundary-Scan tests, following the IEEE Std 1149.1, it is possible to regain access to the pins for interconnection tests. In this way a quality assurance (QA) is possible to verify that the integration was done correctly and that the circuitry and the electronics are working properly.

The present user-friendly system is presented, including the description of additionally developed hardware as well as necessary adjustments to the netlist files and Boundary-Scan Description Language (BSDL) Files of the ASICs. Achieved measurement results from the so far produced detector modules are shown.