Regensburg 2016 – scientific programme

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MA: Fachverband Magnetismus

MA 17: Poster Session I

MA 17.18: Poster

Tuesday, March 8, 2016, 09:30–12:30, Poster B1

Minimization of redepositions during ion beam etching by using a dual angle etching technique — •Michael Schneider¹, Martin Kewenig¹, Tobias Fischer¹, Bert Lägel², Thomas Löber², and Burkard Hillebrands¹ — ¹Fachbereich Physik and Landesforschungszentrum OPTIMAS, Technische Universität Kaiserslautern, 67663 Kaiserslautern, Germany — ²Nano Structuring Center, Technische Universität Kaiserslautern, 67663 Kaiserslautern, Germany

The occurence of redeposition effects in the ion beam etching process is usually minimized by optimizing the etching angle. However, there are still non-negligible redepositions, such as the formation of raised edges on microstructures. We observed raised edges with heights of up to several tens of nanometers, which is even larger than the thickness of the structures.

Etching in two steps by different angles can provide a further reduction of these effects. We have fabricated waveguides of the ferromagnetic materials Ni₈₁Fe₁₉ and Co₄₀Fe₄₀B₂₀ by using a dual angle etching technique. As a result, we achieved a significant reduction of the raised edges on microstructures, which has been examined by Atomic Force Microscopy and Scattered Electron Microscopy measurements.

These findings pave the way for future applications in magnon spintronics, since the surface quality of magnetic waveguides has a noticeable influence on the propagation properties of spin waves in such microstructures.