Regensburg 2016 – scientific programme
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O: Fachverband Oberflächenphysik
O 72: Solid-Liquid Interfaces: Reactions and Electrochemistry
O 72.2: Poster
Wednesday, March 9, 2016, 18:15–20:30, Poster A
Laterally varying electrochemical deposition of solid copper on magnetically patterned exchange bias templates — •Iris Koch1, Florian Ahrend1, Timo Ueltzhöffer1, Svetlana Ivanovna Shevtsova2, Philipp Martin Reintanz1, Ulrich Siemeling1, and Arno Ehresmann1 — 1Institute of Physics and Center for Interdisciplinary Nanostructure Science and Technology (CINSaT), University of Kassel, Heinrich-Plett-Str. 40, D-34132 Kassel — 2Research Institute of Physics, Southern Federal University, Stachki Ave. 194, RUS-344090 Rostov-on-Don
The inhomogeneous magnetic field landscape above magnetically patterned exchange bias (EB) systems [1] was utilized to influence the electrochemical reaction between a copper sulfate solution and a tantalum layer in a laterally anisotropic way. Thus, a local change of the copper deposition rate due to the specially designed magnetic stray fields acting on the paramagnetic Cu2+ ions is initiated. For process optimization, parameters like ion concentration, deposition time, and tantalum layer thickness were varied and analyzed by optical microscopy and energy dispersive x-ray spectroscopy. In all of the performed experiments, a significant influence of the EB system’s magnetic pattern and, therefore, surface properties on the electrochemical reaction could be observed. This novel concept appears to be a promising method for the controlled growth of metallic nanowires.
[1] F. Ahrend et al., J. Magn. Magn. Mater. 381, 292 (2015)