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DS: Fachverband Dünne Schichten

DS 17: Poster Session I

DS 17.78: Poster

Dienstag, 13. März 2018, 18:15–20:15, Poster B

Chemical Solution Deposition of Poly(methyl methacrylate) thin films via dielectric barrier discharge — •Fan Guo^1,2, Lisa Wurlitzer^1,2, Wolfgang Maus-Friedrichs^1,2, and Sebastian Dahle^1,2 — ¹Clausthal Centre of Material Technology, 38678 Clausthal-Zellerfeld, Germany — ²Institute of Energy Research and Physical Technologies, 38678 Clausthal-Zellerfeld, Germany

Plasma-enhanced chemical vapour deposition (PECVD) is an effective method to synthesise Poly(methyl methacrylate)(PMMA) thin films. Normally, the monomer methyl methacrylate (MMA), used as a precursor, is plasma polymerized in the gas phase. In this work, a new way to synthesize PMMA thin films from the liquid phase of MMA via a dielectric barrier discharge (DBD) is presented. The idea of this plasma-enhanced chemical solution deposition (PECSD) is based on radical initiation at the interface with a liquid phase of MMA by a non-thermal plasma. With this method, no vacuum condition or carrier gas streams are needed as opposed to the common PECVD technique. The deposited films were characterized with attenuated total reflection (ATR) infrared spectroscopy, differential scanning calorimetry (DSC) and gel permeation chromatography (GPC).