Berlin 2018 – wissenschaftliches Programm
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DS: Fachverband Dünne Schichten
DS 29: Lithography III: Lithography and Structuring (joint session KFM/DS)
Donnerstag, 15. März 2018, 09:30–12:50, EMH 025
While high-resolution 2D lithography and structuring is relatively mature and also widely applied in industrial processes, work on its 3D variant is mostly focusing on fundamental aspects and process development. At the lower edge of possible 3D feature dimensions, certainly methods such as electron beam induced deposition, non-linear multi-photon-laser lithography and thermal scanning probe lithography techniques are required. This session discusses most of these dedicated 3D methods in detail. For the fabrication of complex 2D and 2.5D patterns, advanced electron beam and X-ray methods are continuously developed further. In addition, new methods such as high resolution Talbot lithography for relatively large areas are already entering industrial maturity. This session also discusses some of the latest developments in this field of binary lithography.
Organizer: Robert Kirchner - Technische Universität Dresden