Berlin 2018 – scientific programme
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DS: Fachverband Dünne Schichten
DS 29: Lithography III: Lithography and Structuring (joint session KFM/DS)
DS 29.6: Talk
Thursday, March 15, 2018, 11:50–12:10, EMH 025
A high contrast multilayer process for electron beam lithography using different developers — •Philip Trempler1, Frank Heyroth2, Matthias Schirmer3, Christian Kaiser3, Tobias Mai3, and Georg Schmidt1, 2 — 1Institut für Physik, Martin-Luther Universität Halle-Wittenberg, 06099 Halle (Saale), Germany — 2Interdisziplinäres Zentrum für Materialwissenschaften, Martin-Luther Universität Halle-Wittenberg 06099 Halle (Saale), Germany — 3ALLRESIST GmbH, Am Biotop 14, 15344 Strausberg, Germany
We have developed a new multilayer resist system for the fabrication of three-dimensional nanostructures in a one-step electron beam exposure. The multilayer resist consists of three layers with different sensitivity and different process chemistry. The sensitivity of the three layers to different respective developers allows a very large controllable undercut in the middle layer. The low sensitivity bottom layer can be patterned in high detail almost independent from the pattern exposed in the two layers on top. At acceleration voltage of 30 kV the resist is ideally suited for the fabrication of for example T-gate structures by lift-off in a high reliability process with a very large process window.