Berlin 2018 – wissenschaftliches Programm

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DS: Fachverband Dünne Schichten

DS 35: Lithography IV: Lithography and Structuring (joint session KFM/DS)

DS 35.3: Vortrag

Donnerstag, 15. März 2018, 15:50–16:10, EMH 025

Photomask Manufacturing Technology - An Overview — •Christian Buergel, Torben Heins, and Martin Sczyrba — AMTC Dresden, Raehnitzer Allee, 0199 Dresden, Germany

Semiconductor devices are designed as vertical stacks of electrical components (e.g. transistors, capacities, wiring and connections), which are manufactured layer by layer during wafer processing.

Pattern formation on the wafer is done by using projection lithography and photomasks are key elements for the lithography. At least one photomask is required for each layer, where the mask contains the design information and is used as master for the desired geometries. The design, as represented on the photomasks, is replicated as a 4x de-magnified image onto the wafer in the desired amount, hence enabling rapid and cost effective semiconductor production.

This presentation will give a broad overview of the manufacturing chain of a photomask. It will introduce into required processes like data preparation and manipulation for mask writing, resist and absorber material processing, metrology and inspection as well as mask repair and its qualification.