Berlin 2018 – scientific programme

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DS: Fachverband Dünne Schichten

DS 35: Lithography IV: Lithography and Structuring (joint session KFM/DS)

DS 35.7: Talk

Thursday, March 15, 2018, 17:30–17:50, EMH 025

Analysis of rough nanostructured surfaces by EUV-scatterometry — •Analía Fernández Herrero, Frank Scholze, and Victor Soltwisch — Physikalisch-Technische Bundesanstalt, Abbestr. 2-12, 10587 Berlin, Germany

Lamellar-gratings are commonly-used as diffractive optical elements or in state-of-the-art integrated electronic circuits. For the control of the lithographic manufacturing process in semiconductor manufacturing a rapid in-line characterization of the nanostructures is indispensable. With shrinking structure sizes, roughness gains influence on the device performance. Therefore the analysis of nanostructured surfaces demands the development of new metrology tools capable of destruction-free measurements, which, at the same time, deliver statistical information, relevant for the study of the imperfections. Small angle X-ray scattering under grazing incidence has already been investigated for the determination of the geometry parameters of such structures. Several reports stress the importance of the identification of the roughness contributions. Using EUV or soft X-ray radiation, with longer wavelengths, larger incidence angles can be used reducing the beam footprint on the samples without compromising the surface sensitivity. We present a new experimental tool to be developed at the PTB soft X-ray beamline at the electron storage ring BESSY II for the measurement of small structures and roughness contributions based on soft X-ray and EUV scatterometry.