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HL: Fachverband Halbleiterphysik

HL 24: Poster Session II

HL 24.26: Poster

Dienstag, 13. März 2018, 18:30–20:30, Poster F

Covalent coupling of plasmonic metal and semiconductor nanoparticles — •Jannik Rebmann, Phillip Witthöft, Simon Schneider, Christian Strelow, Tobias Kipp, and Alf Mews — Institute of Physical Chemistry, University Hamburg, Grindelallee 117, 20146 Hamburg, Germany

Hybrid structures consisting of plasmonic metals and semiconductor nanoparticles are of great importance since the plasmonic properties of the metal can strongly influence the fluorescent behavior of the semiconductor. For instance, if the plasmon of the metal is in resonance with the excitonic recombination energy of the semiconductor this would influence the recombination rate and can be observed by a change of the decay of fluorescence lifetime, provided that the semiconductor and metal are not in direct contact, which would lead to fluorescence quenching due to charge transfer processes. Hence, the distance between the metal and the semiconductor has a huge influence on these effects. Therefore, we present a new method for building hybrid structures consisting of gold-nanorods covalently bonded to CdSe/CdS-dot-in-rod (DR) structure, which are covered with a thin silica shell with variable thickness. Using the EDC-NHS-coupling mechanism a covalent amide bond is formed between the carboxyl groups on the plasmonic metal particle and the terminal amine groups on the DRs. The anisotropic geometry of gold nanorods gives great opportunities to tune the plasmon resonance in order to enhance plasmon-exciton-coupling.