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HL: Fachverband Halbleiterphysik

HL 48: Thermoelectricity

HL 48.3: Vortrag

Donnerstag, 15. März 2018, 17:30–17:45, EW 015

performance simulation of micro thermoelectric coolers — •David Alberto Lara Ramos, Vida Barati, Gabi Schierning, Heiko Reith, and Kornelius Nielsch — Leibniz-Institut für Festkörper- und Werkstoffforschung. Dresden. Germany

Micro thermoelectric coolers are increasingly considered as an attractive technology to meet the heat management requirements in electronic and solid state devices due to their simplicity, compact size, robustness, noise free operation, high long term reliability (due to their lack of mechanical moving parts or working fluids) and subsequently maintenance free capability and fast control response. However, due to nature of thermoelectricity, a comprehensive device performance simulation process is needed in order to fully make use of the available material properties; and this device optimization turns to be challenging due to the thermoelectricity Multiphysics environment which involves coupled electrical and heat fluxes. Furthermore, despite optimization strategies for macro thermoelectric coolers are well known, new challenges take place when designing thermoelectric coolers at the micro scale. In the present work, finite element analysis were performed in order to study the parasitic effect of the geometrical definition of a single leg pair micro thermoelectric module manufactured by available state of the art lithography and electrochemical deposition techniques. The obtained results show how the observed maximum temperature suppression and heat dissipation power, are affected by parasitic effects, such as Joule heating and heat flux across the thermoelectric leg pair.