Berlin 2018 – scientific programme

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MM: Fachverband Metall- und Materialphysik

MM 27: Poster Session I

MM 27.2: Poster

Tuesday, March 13, 2018, 18:30–19:45, Poster E

Contacts Between Cu and Sn Nanowires — •Zezhao Chen, Ziyi Wang, Samuel Griffiths, and Guido Schmitz — Institute of Materials Science Chair of Materials Physics, Heisenbergstr. 3, 70569 Stuttgart, Germany

Due to the commercial push for the size reduction of electronics and components therein, nanowires play an important role in the electronics industry. In this work, Cu-Sn nanowires have been studied, which are of scientific interest as solder-able nanostructures. The nanowires have been produced via electrodeposition using polycarbonate membranes as templates. First, Cu nanowires (50 nm in diameter) are partially grown from a CuSO4 solution and subsequently Sn is electrodeposited onto the Cu using a SnSO4 solution, resulting in segmented Cu-Sn nanowires. Furthermore, heat treatments at temperatures ranging from 220 °C - 400 °C are performed to investigate the formation of intermetallic phases within the dimensionally restricting nanowires. TEM, SEM, and EDX data has been evaluated to identify reaction products and growth mechanism.