Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

MM: Fachverband Metall- und Materialphysik

MM 47: Poster Session II

MM 47.35: Poster

Mittwoch, 14. März 2018, 18:30–19:45, Poster C

Description of 3D polycrystalline microstructures using a tessellation model generated by ellipsoids — •Mingyan Wang¹, Lukas Petrich², Daniel Westhoff², Volker Schmidt², and Carl E. Krill III¹ — ¹Institute of Micro and Nanomaterials, Ulm University — ²Institute of Stochastics, Ulm University

With 3D imaging techniques increasingly being employed to probe the microstructure of materials, we are gaining a much more comprehensive view of their internal structure, while simultaneously being confronted by an enormous amount of data! For example, in our research we have characterized polycrystalline Al-5 wt% Cu alloys by synchrotron-based 3D X-ray diffraction (3DXRD) microscopy. In this technique, the 3D microstructure is reconstructed from numerous far-field and near-field diffraction images. We obtained time-resolved information by recording a 3D snapshot after each ex situ annealing step. An ellipsoid-based tessellation model was then fitted to each data set to approximate complex grain morphologies. Compared to voxel-based representations of microstructure (such as those provided by 3DXRD characterization), tessellations save a considerable amount of storage space while retaining most of the information regarding the real microstructure. In addition, tessellations obviate the meshing step that must otherwise be performed in order to calculate grain boundary properties like local curvature and dihedral angle, which are critical for understanding the kinetics of grain boundary migration. Compared to meshed experimental data, the ellipsoid-based tessellation model yields consistent results for such properties.