Erlangen 2018 – wissenschaftliches Programm
Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe
P: Fachverband Plasmaphysik
P 13: Low Pressure Plasmas - Poster
P 13.8: Poster
Dienstag, 6. März 2018, 16:15–18:15, Redoutensaal
Protective coating for electronic assemblies against environmental influences - a high throughput low pressure plasma process for in-line integration — Fabian Utzmann1, •Florian Eder1, and Bastian J. M. Etzold2 — 1Siemens AG Corporate Technology, 91058 Erlangen, Germany — 2Technische Universität Darmstadt, 64287 Darmstadt, Germany
Printed circuit boards need to be protected against corrosive influences in order to guarantee functionality and safety. In this regard, current varnish based solutions do not always provide a flawless conformal coating and require extensive processing efforts. Replacing these coatings by a plasma polymer will allow improving overall protection properties while reducing processing costs. Yet, current plasma coaters are not designed for a seamless integration into existing electronic production lines. The challenge is to use standard handling and transportation systems in electronic production as substrate carriers in the plasma coater. To counter these challenges a new plasma reactor was designed from scratch around a substrate carrier. This allows a coating application onto a stack of printed circuit boards as well as a corresponding development of coatings including precursor and process parameter evaluation. The deposited coatings were characterized regarding film thickness, defect density, chemical structure elucidation by fourier transform infrared spectroscopy and protection properties in standard temperature and humidity tests.