Erlangen 2018 – scientific programme

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P: Fachverband Plasmaphysik

P 20: Plasma Wall Interaction II - Poster

P 20.3: Poster

Wednesday, March 7, 2018, 16:15–18:15, Zelt West

Ultra-precise Machining of Surfaces Using Microwave-driven Cl-based Plasma Etching — •Faezeh Kazemi and Thomas Arnold — IOM Leibniz-Institute of Surface Engineering, Leipzig, Germany

Reactive plasma jet machining (PJM) is a technology for ultra-precise surface shape generation which can provide high etch rates due to its chemical characteristic. The basis of reactive plasma etching is the reaction between gas-phase radicals generated in a plasma discharge and the solid surface in order to form a volatile etch product. Etching processes for silicon-based materials have been mostly investigated using fluorine-based reactive plasmas since most of fluoride-silicon compounds are volatile. However, Al and some other elements do not form volatile etch products in fluorine-based plasmas. Therefore, extending the choice of reactive etch gases is required for the applicability to a new range of materials.

The aim of this study is to develop and use a plasma jet that contains reactive chlorine compounds and some other non-halogenated etch gases which are admixed to inert plasma gases like argon and helium. For this purpose, we investigate a fine-focused microwave powered plasma jet. Reactive species like atomic chloride or hydrogen are generated in the plasma jet by dissociation of suitable process gases. The etching behavior and reaction kinetics in a chlorine-based plasma jet process are examined for different substrate materials aiming to clarify the chemical kinetics of surface reactions.