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T: Fachverband Teilchenphysik

T 25: Silizium-Streifen-Detektoren II / Pixel-Detektoren

T 25.3: Vortrag

Dienstag, 20. März 2018, 17:00–17:15, Philo-HS2

Investigation of the impact of mechanical stress on the properties of silicon strip sensors — •Martin Stegler, Luise Poley, and Ingo Bloch — DESY, Platanenallee 6, Zeuthen, Germany

Over the next few years the luminosity of the Large Hadron Collider (LHC) at the European Organization for Nuclear Research (CERN), will be increased to accumulate higher number of collisions to gain access to rare processes. It is planned to reach in 2023 an instantaneous luminosity at the LHC of L = 6·10³⁴ cm⁻²s⁻¹. Due to the resulting higher radiation level, the ATLAS Inner Detector is foreseen to be replaced with the ATLAS Inner tracker, consisting of a pixel tracker and a strip tracker. The upgraded strip tracker will consist of 18000 silicon strip detector modules, each consisting of silicon sensors, circuit boards and readout chips. Adhesives are used to connect the modular components thermally and mechanically. Due to different coefficients of thermal expansion of the various involved materials, temperature changes between construction (22 ^∘C) and operation (-30 ^∘C) lead to the exertion of mechanical stress on the sensor. This contribution shows measurements quantifying the impact of mechanical stress on sensors and investigating resulting sensor damages. A cooled module was tested in comparison with simulations of the thermal induced tensile stress near to the surface of a silicon sensor in a module. A four-point bending setup was used to measure the electrical properties for two versions of ATLAS strip sensors. In a setup with a beta source, the influence of the changes of the electrical properties on the silicon strip sensor module performance were measured.