Aachen 2019 – scientific programme

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T: Fachverband Teilchenphysik

T 27: Halbleiterdetektoren II

T 27.8: Talk

Tuesday, March 26, 2019, 17:45–18:00, H03

Performance and outlook of a large fill-factor DMAPS in a 150nm CMOS process for the ATLAS HL-LHC upgrade — •Ivan Caicedo, Christian Bespin, Jochen Dingfelder, Tomasz Hemperek, Toko Hirono, Fabian Hügging, Hans Krüger, Piotr Rymaszewski, Tianyang Wang, and Norbert Wermes — Physikalisches Institut, Universität Bonn. Bonn, Germany.

Monolithic CMOS active pixel sensors in depleted substrates (DMAPS) are under consideration for the upgrade of the outer pixel layers of the ATLAS experiment at the LHC. In this upgrade, the area of the pixel modules will be increased tenfold and the so-called HL-LHC is expected to reach a luminosity of 7.5 x 10³⁴ cm⁻² s⁻¹. The high collision rate will result in NIEL and TID radiation damage levels of 10¹⁵ n_eq/cm² and 80 Mrad in the outermost pixel region of the inner tracker by the end of operation. Manufacturing DMAPS in a CMOS process reduces the costs and time for large volume production. Thanks to technology add-ons and careful design the sensor collects charge through drift, which improves its efficiency after irradiation.

This talk will summarize the performance of LF-MONOPIX01: a large fill-factor DMAPS designed in a 150nm CMOS process on a highly resistive substrate. The chip was successfully read out by a fast synchronous architecture and back-side processed after thinning down to 200µm. It showed a small noise increase and hit detection efficiency of ∼ 99% after irradiation up to the dose levels expected in the HL-LHC. At the end of the presentation, the plans for future design efforts based on the encouraging results will be introduced.