München 2019 – scientific programme
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P: Fachverband Plasmaphysik
P 18: Postersitzung
P 18.1: Poster
Thursday, March 21, 2019, 16:30–18:30, Foyer Audimax
Modeling and Study of a Remote Plasma Source for High-rate Etching — •Steffen Pauly1, Andreas Schulz1, Matthias Walker1, Bernhard Schmid1, Günter Tovar1, and Klaus Baumgärtner2 — 1Institute of Interfacial Process Engineering and Plasma Technology IGVP, University of Stuttgart, Stuttgart, Germany — 2Muegge GmbH, Reichelsheim, Germany
Photoresists are used in industry for lithographic processes to produce surface structures in the sub-micrometer range. In the final step of the manufacturing process, the cured polymer layer acting as shaping die for the microstructures grown by electroplating must be removed. Etching of the cured resist pattern poses an extreme challenge, as the microstructures must not be damaged. Dry plasma chemical etching by means of radicals generated in the plasma chamber of a remote plasma source (RPS) is a suitable means avoiding damage to the microstructures made of metals like nickel, copper or gold. Using FEM, a model of the RPS has been developed to investigate the microwave distribution and the microwave coupling into the plasma chamber. The E-field distribution is experimental measured by heating up substrates and visualized by liquid-crystal sheets and thermal camera pictures. If a plasma is ignited, the electron density and thus the permittivity and the conductivity increase, which changes the electric field distribution in the plasma chamber. For this purpose, the model has been extended in a first step by a Drude model. To validate the Drude model, Langmuir- and double probe measurements were made, as well as pictures with a high-speed camera system.