Regensburg 2019 – scientific programme

Parts | Days | Selection | Search | Updates | Downloads | Help

MM: Fachverband Metall- und Materialphysik

MM 12: Poster session I

MM 12.7: Poster

Monday, April 1, 2019, 19:15–20:45, Poster C

Deoxidation of copper surfaces by a dilectric barrier discharge plasma — •Aaron Arendt¹, Sebastian Dahle¹, and Wolfgang Maus-Friedrichs^1,2 — ¹Clausthaler Zentrum für Materialtechnik, TU Clausthal, Leibnizstr. 9, 38678 Clausthal-Zellerfeld, Germany — ²Institut für Energieforschung und Physikalische Technologien, TU Clausthal, Leibnizstr. 4, 38678 Clausthal-Zellerfeld, Germany

The production in the metalworking industry takes place in the presence of oxygen. Although, attempts are made to keep the concentration of oxygen low with the aid of technical high vacuum and inert gases, there is still an oxide layer on the metal surfaces, which can form immediately under these conditions. This oxide layer could be advantageous for applications, for example in joining processes. State of the art is to reduce the surface by heat treatment with the help of high temperatures in order to make connections possible. Here, we present an alternative process in form of a DBE plasma in an argon/hydrogen atmosphere using the example of an oxidized copper sample. This plasma is used to reduce the copper oxide surface at room temperature. To reduce also deeper layers, the copper is additionally heated to allow diffusion processes to take place. X-ray photoelectron spectroscopy (XPS) is used to investigate the surface stoichiometry and depth profiling is done with a combination of sputtering and auger electron spectroscopy (AES). We show that 60 s of plasma treatment leads to an appreciable deoxidation of the copper surface.