Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

MM: Fachverband Metall- und Materialphysik

MM 20: Poster session II

MM 20.17: Poster

Dienstag, 2. April 2019, 18:30–20:00, Poster C

Measurements of mechanical properties and microstructure on thin Cu based alloys — •Christian Aaron Rigoni, Martin Peterlechner, Harald Rösner, and Gerhard Wilde — Institute of Materials Physics, University of Münster, Germany

The mechanical properties of alloys are essential to industrial applications. Tensile testing is thus an appropriate material characterization technique. In general, such devices are bonded to certain sample dimensions as thickness and length. Thus measurements of microscale foils are a challenging task. An important point in this setup is the previous sample preparation since the sample cutting and finishing has a noticeable impact on the performance of the measurement. This effect was investigated in detail using wire erosion, punching, water and laser cutting. We analyse mechanical properties of thin Cu rich sheets with a thickness down to about 40 μm and a length of about 4 mm that were measured with a miniaturized tensile testing device. The goal is to obtain the dependence of the ultimate tensile strength and creep behavior in dependence of different temperatures with respect to the microstructure. A Norton-Bayley plot is obtained from the creep data in order to access the material constants and the results were discussed.