Regensburg 2019 – wissenschaftliches Programm

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MM: Fachverband Metall- und Materialphysik

MM 20: Poster session II

MM 20.8: Poster

Dienstag, 2. April 2019, 18:30–20:00, Poster C

The Impact of an Effective Triple-line Energy on Solder Reflow and Difficulties in its Quantification — •Samuel Griffiths and Guido Schmitz — Institute for Materials Science, Stuttgart University, Germany

Micro-solder technologies are ubiquitous in modern electronics industries. Although these industries have driven vast practical advancements in solder technologies, little is understood about the impact of miniaturization on the reflow behaviour of solder on metal conductive tracks.

This work investigates the reflow behavior of Sn-based micro-solder on micro-structured Cu and Ni capillary tracks for various track widths. The results are compared both with the ideal wetting model of surface and interface energy equilibrium and a modified model containing a term for an effective triple-line energy which causes the steady state contact angles to deviate from the ideal case. Difficulties surrounding sample production, measurement and analysis are discussed. The difference between general surface roughness and substrate defect sites is discussed in relation to the quantification of an effective triple-line energy. The presence of an effective triple-line energy is confirmed through comparisons between surface energy optimisation modelling and experimental results.

Future work will entail further minimisation of sample dimensions towards a strip width of 1 micrometer and the process to achieve this as well as the inherent difficulties will be discussed.