Bonn 2020 – scientific programme
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T: Fachverband Teilchenphysik
T 13: Pixel detectors I
T 13.1: Talk
Monday, March 30, 2020, 16:30–16:45, H-HS XIV
Quality Control Measurements of RD53A on Wafer- and Module Level — •Michael Daas, Markus Frohne, Tomasz Hemperek, Florian Hinterkeuser, Fabian Hügging, Hans Krüger, David-Leon Pohl, Mark Standke, Marco Vogt, Norbert Wermes, and Jochen Dingfelder — Physikalisches Institut der Universität Bonn
The Large Hadron Collider (LHC) at CERN will be upgraded for higher luminosities in 2025. The increased luminosity poses new demanding requirements for its detectors.
This talk gives an overview over preparations for quality control measurements based on the RD53A readout ASIC, developed by the RD53 collaboration. It features a small pixel pitch of 50 × 50 µ m2 to mitigate single-pixel pile-up, higher data rate capabilities and high radiation tolerance. This enables the chip to cope with the high occupancy of up to 3· 109 hits· cm−2 · s−1, that is expected in some areas of the ATLAS tracking detector of the upgraded LHC.
After an extensive characterization phase in the last years, first module assemblies based on RD53A are now used to develop QC procedures for ATLAS ITk module production. This talk covers the development of a wafer probing setup for quality control of bare readout ASICS on wafer level, as well as the first preparations for a module test setup. Since the University of Bonn is one of the largest module production sites within the ATLAS collaboration, many of the about 10000 modules for the ATLAS ITk Pixel Detector will be assembled and tested here.