Bonn 2020 – scientific programme

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T: Fachverband Teilchenphysik

T 31: Pixel detectors II

T 31.6: Talk

Tuesday, March 31, 2020, 18:20–18:35, H-HS XIV

Bump bond stress tests with ITk-Pixel-style daisy-chain and FE-I4-modules through thermal cycling — •Steffen Korn, Jörn Große-Knetter, Jörn Lange, and Arnulf Quadt — II. Physikalisches Institut, Georg-August-Universität Göttingen

Early module prototypes for the new ATLAS Inner Tracker Pixel Detector (ITk) highlighted bump bond connections as a possible point of failure in future ITk Pixel modules when exposed to thermally induced stress. In order to investigate this issue, daisy chain modules with realistic bump bond pitch and modules with read-out-chips were tested before, during, and after exposure to thermal stress through cycling in a thermal shock chamber in Goettingen. The results of these tests using different modules with different assembly options are presented in this talk.