Bonn 2020 – scientific programme

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T: Fachverband Teilchenphysik

T 48: Pixel detectors III

T 48.6: Talk

Wednesday, April 1, 2020, 17:45–18:00, H-HS V

ITk-Pixel prototype module assembly and testing — Jörn Große-Knetter, Jörn Lange, •Silke Möbius, and Arnulf Quadt — II. Physikalisches Institut, Georg-August-Universität Göttingen

For the upgrade of the LHC to the High-Luminosity-LHC, the ATLAS tracking detector will be replaced with a pure silicon detector, the Inner Tracker (ITk), as the higher luminosity asks for radiation hard components that can deal with higher occupancies and radiation. Given the close proximity to the interaction point, the environment is especially challenging for the pixel detector, which features 3D and planar sensors.

A global market survey on the sensors as well as the bonding to the readout chip has been started. Several institutes are involved in sensor testing with laboratory as well as testbeam measurements. Our working group contributes to the planar sensor market survey.

Additionally, a new readout chip is under development, allowing a faster and reliable readout of the sensors. In order to characterize and test ITk-Pixel prototype modules with the RD53A, a prototype chip, up to 200 modules are built and tested at several institutes. At a later stage, modules will be integrated into a demonstrator to test the system. Our working group in Göttingen is involved in the development of the tooling, needed for the assembly of the module and the assembly and testing itself.

This talk will give an overview of the measurements performed so far and focus on the ITk-Pixel module assembly and tests in our group.