Bonn 2020 – wissenschaftliches Programm
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T: Fachverband Teilchenphysik
T 63: DAQ, trigger and electronics III
T 63.5: Vortrag
Mittwoch, 1. April 2020, 17:30–17:45, L-3.015
High Density Interconnects for the Mu3e experiment — •Lars Noehte for the Mu3e collaboration — Physikalisches Institut, Heidelberg, Germany
The Mu3e experiment is going to search for the charged lepton-flavor violating decay µ+ → e+ e− e+ with a sensitivity of one in 1016 events in phase II. Since the tracking of the decay electrons (positrons) is dominated by multiple scattering, the detector material thickness has to be minimized. The tracking layers of the detector deploy the HV-MAPS pixel sensor MuPix, which can be thinned down to 50 µ m. Achieving a thickness of X/X0 = 0.115% radiation lengths per layer requires an ultra-thin readout structure, capable of transmitting 1.25Gb/s of data reliably over a high density interconnect. This talk focuses on design studies and characterizations of edge-coupled micro strips on 12 µ m thick aluminum layers.