Bonn 2020 – scientific programme

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T: Fachverband Teilchenphysik

T 82: Pixel detectors IV

T 82.7: Talk

Thursday, April 2, 2020, 18:00–18:15, L-2.004

Testbeam measurements with passive CMOS pixel sensors in 150 nm LFoundry technology bump-bonded to the RD53A readout chip — •Yannick Dieter, Michael Daas, Tomasz Hemperek, Fabian Hügging, Jens Janssen, Hans Krüger, David-Leon Pohl, Mark Standke, Marco Vogt, Tianyang Wang, Norbert Wermes, and Jochen Dingfelder — Physikalisches Institut der Universität Bonn

The Large Hadron Collider at CERN will be upgraded to the High-Luminosity-LHC and will deliver an instantaneous luminosity increased by a factor of 5 - 8 from 2026 on compared to now. In order to cope with the increased radiation level and hit rate, detectors with better radiation tolerance and higher data rate capabilities are demanded. Therefore, the ATLAS experiment develops an all-new pixel detector which will consist of 5 barrel layers and an increased surface of approximately 15m².

For the construction of such large scale detectors, commercial CMOS processes, which offer high yield and high throughput at comparatively low costs, are of interest not only for the readout chip but also for the sensor. In order to qualify the suitability of commercial CMOS pixel sensors for the ATLAS pixel detector upgrade, pixel sensors using a 150 nm CMOS technology offered by LFoundry have been designed and produced.

Measurements of the pixel sensor bump-bonded to the RD53A readout chip and test-beam results using a 2.5 GeV electron beam will be presented.