Dresden 2020 –
wissenschaftliches Programm
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CPP 12: Focus: High-resolution Lithography and 3D Patterning (Part I) (joint session KFM/CPP/HL)
Montag, 16. März 2020, 09:30–12:50, TOE 317
Chair: Robert Kirchner (TU Dresden)
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09:30 |
CPP 12.1 |
Hauptvortrag:
Novel device integration - combining bottom-up and top-down approaches — •Artur Erbe
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10:00 |
CPP 12.2 |
Fabrication of NbC Josephson-junction arrays by focused-ion-beam-induced deposition — •Fabrizio Porrati, Felix Jungwirth, Sven Barth, and Michael Huth
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10:20 |
CPP 12.3 |
Avoiding amorphization during semiconductor nanostructure ion beam irradiation — •G. Hlawacek, X. Xu, W. Möller, H.-J. Engelmann, N. Klingner, A. Gharbi, K.-H. Heinig, S. Facsko, and J. von Borany
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10:40 |
CPP 12.4 |
Grayscale Lithography: Creating complex 2.5D structures in thick photoresist by direct laser writing — •Dominique Collé
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11:00 |
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20 min. break
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11:20 |
CPP 12.5 |
Hauptvortrag:
Shapeable materials technologies for high resolution patterning of 3D microelectronic devices — •Daniil Karnauschenko
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11:50 |
CPP 12.6 |
Coupling Single Mode Fibers to Single Quantum Emitters using Femtosecond 3D Printing Technology — •Ksenia Weber, Simon Thiele, Simon Ristok, Sarah Fischbach, Jan Hausen, Lucas Bremer, Mark Saritson, Simone Protalupi, Alois Herkommer, Stefan Reitzenstein, Peter Michler, and Harald Gießen
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12:10 |
CPP 12.7 |
Optical properties of photoresists for femtosecond 3D printing: Refractive index, extinction, luminescence - dose dependence, aging, heat treatment and comparison between 1-photon and 2-photon exposure — •Michael Schmid, Dominik Ludescher, and Harald Giessen
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12:30 |
CPP 12.8 |
Acoustic Impedance Matching on Ultrasonic Devices using Additive Manufacturing — •Severin Schweiger, Sandro Koch, Marcel Krenkel, and Marco Kircher
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