Dresden 2020 – scientific programme

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DS: Fachverband Dünne Schichten

DS 20: Focus Session: Organic-based Hybrid Thermoelectrics I

DS 20.3: Invited Talk

Wednesday, March 18, 2020, 10:15–10:45, CHE 89

Thermoelectric microdevices - challenges and perspectives — •Gabi Schierning — IFW Dresden, Dresden, Germany

Next generation electronic devices require intelligent thermal management strategies in order to remove high density heat fluxes from the active electronic components or to harvest small amounts of energy for low-power electronics. Hence, hardware solutions for a smart and efficient thermal management are sought for. Micro-scale thermoelectric coolers (TEC) are therefore developed as one part of the thermal management. To fabricate these micro-scale TECs, we developed a fabrication technology such that tellurium-based compound semiconductors with decent thermoelectric performance at room temperature are deposited by electrochemical deposition combined with structuring by photolithographic processing. Current and temperature dependent cooling performances, transient cooling response, cooling cycling, and long-term stability under constant current of these micro-devices will be shown. Challenges that will be discussed are i) to integrate high figure-of-merit materials into the fabrication process, ii) to integrate the devices into real electronic circuitry, iii) to operate and characterize such devices as thermoelectric micro-harvesting devices rather than as micro cooling devices.