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HL: Fachverband Halbleiterphysik

HL 3: Focus: Diamond Technology and Electronics (joint session KFM/DS/HL)

HL 3.2: Hauptvortrag

Montag, 16. März 2020, 10:00–10:30, HSZ 105

Research and development for fabrication of diamond wafers for industrial use — •Hideaki Yamada — AIST, Osaka, Japan

Figure of merits of diamond as a candidate material in power electronics are superior to those of other materials, such as Si, SiC, and GaN. Especially, recent increase of the power density in power devices for high-frequency use require extremely high thermal conductivity of diamond. On the other hand, because of its stable quantum state under the standard condition, variety of sensors with wide dynamic-range and quantum computing have been studied. Therefore, in addition to its mechanical and optical applications, use of diamond in spintronics as well as electronics have been attracted researchers for variety of future applications in industry. One of the bottle necks for realization of them is in technique to fabricate diamond wafers with large area and sufficient quality under acceptable cost. We have developed techniques to enlarge seed substrates, and process them to wafers. To understand mechanism of the crystal growth, we simulated the growth environment numerically and compared them with experimental results. Our recent trials, achievement and future prospective to solve above issues aiming at realization of the industrial use of diamond will be presented with the related current state-of-the-art.