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HL: Fachverband Halbleiterphysik

HL 63: Focus: High-resolution Lithography and 3D Patterning (Part II) (joint session KFM/CPP/HL)

HL 63.2: Vortrag

Donnerstag, 19. März 2020, 09:50–10:10, TOE 317

3D printing of complex submillimeter-sized wide angle objectives — •Zhen Wang¹, Ksenia Weber¹, Simon Thiele², Alois Herkommer², and Harald Giessen¹ — ¹4th Physics Institute and Research Center SCoPE, University of Stuttgart, Pfaffenwaldring 57, 70569 Stuttgart, Germany — ²Institute of Technical Optics and Research Center SCoPE, University of Stuttgart, Pfaffenwaldring 9, 70569 Stuttgart, Germany

Compact image sensors with a variety of focal lengths, fields of view, and other optical parameters, will be the enabling technology of integrated devices for industry 4.0. In order to miniaturize the imaging devices from currently several mm³ to below 1 mm³, and to achieve diameters of the optics below 1 mm, 3D printing with femtosecond laser pulses is the method of choice. Here, we present several multi-lens designs as well as printed objectives with fields of view that range from 60^∘ to 95^∘, and focal lengths in the range of 200-300  µm, with diameters around 800 µm, which allow for wide-angle imaging. We characterize their performances and report how to overcome some issues when printing such challenging designs. In the future, those objectives can be directly printed onto CMOS imaging chips which will enable very compact image sensors.