Dresden 2020 – scientific programme

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MM: Fachverband Metall- und Materialphysik

MM 30: Poster Session II

MM 30.11: Poster

Tuesday, March 17, 2020, 18:15–20:00, P4

Mechanical testing of SAC soldered micro- and nanowire joints — •Samuel Griffiths and Guido Schmitz — Chair of Materials Physics, Institute for Material Science University of Stuttgart, Germany

Joining is a ubiquitous component of many modern macro- and microscopic technologies, and as such joints continue to be miniaturized, it becomes increasingly necessary to evaluate the effects of miniaturization on the mechanical properties of the structural materials. Wires are fundamental building blocks which have been extensively examined for their promising electrical/surface properties - considered for use in different micro and nano devices. Quantifications of their mechanical properties although remains limited.

Most fundamental to understanding the mechanical strengths and limitations of nanowires, is determining their dependency on diameter. Here, we present our creative methodology for mechanically testing Cu micro-/nanowires soldered to substrates with SAC to initially determine the weakest link. Additionally, our preliminary tensile results are presented in dependence of diameter. Experiments were conducted in an environmental SEM including both in-situ soldering and mechanical testing under constant temperature conditions. The phenomenological reasoning for the size dependency is also alluded to.