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MM: Fachverband Metall- und Materialphysik
MM 60: Mechanical Properties: Plasticity, fracture, fatigue, wear - I
MM 60.6: Vortrag
Donnerstag, 19. März 2020, 17:00–17:15, IFW B
How to optimize strength and conductivity in metallization layers by alloying? — •Viswanadh Gowtham Arigela1, Tobias Oellers2, Alfred Ludwig2, Christoph Kirchlechner1, and Gerhard Dehm1 — 1Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Dusseldorf, Germany — 2Institute of Materials, Ruhr-Universität Bochum, Bochum, Germany
The current trend of ever harsher environments and power densities in microelectronic applications brings the need of enhanced thermomechanical and electrical properties in metallization layers. It is of particular interest to develop copper alloys with improved strength at service temperature, which can be up to 400°C. Consequently, mechanical characterization of these systems at their service conditions at the micrometer length scale is required. We have used combinatorial approaches to synthesize binary Cu-Ag and Cu-Zr alloys with the aim of enhancing the mechanical properties. The specimens were fabricated from thin-film material libraries using photolithography. The mechanical properties of the alloys were investigated at temperature of up to 400°C using microtensile specimens. Finally, the deformation mechanisms were investigated by scanning electron and transmission electron microscopy. In the talk we will show a substantial improvement of the thin film performance of the alloys. Furthermore, we discuss the underlying strengthening mechanisms. Based on the results we will discuss how alloys with an optimized combination of strength and conductivity can be realized for microelectronic applications.