Parts | Days | Selection | Search | Updates | Downloads | Help
T: Fachverband Teilchenphysik
T 64: Pixel Detectors III
T 64.7: Talk
Wednesday, March 17, 2021, 17:30–17:45, Tn
ITk-pixel prototype module assembly and testing — Baida Achkar, Sascha Böhlken, Raffael Gama, Jörn Große-Knetter, Tim Kanngießer, Jörn Lange, •Silke Möbius, Arnulf Quadt, and Rüdiger Widera — II. Physikalisches Institut, Georg-August-Universität Göttingen
For the upgrade of the LHC to the High-Luminosity-LHC, the ATLAS tracking detector will be replaced with a pure silicon detector, the Inner Tracker (ITk), as the higher luminosity asks for radiation hard components that can deal with higher occupancies and radiation. Given the close proximity to the interaction point, the environment is especially challenging for the pixel detector, which is planned to feature 3D and planar radiation hard sensors and a new readout chip, allowing a faster and reliable readout of the sensors.
In order to characterize and test ITk-pixel prototype modules with the RD53A, a protoype chip, up to 200 modules are built and tested at several institutes. At a later stage, these modules will be integrated in a larger structure, a so-called demonstrator, to test the system functionalities.
Göttingen is responsible for the development of the core part of the tooling, needed for the gluing of the flex PCB in the assembly of the module and is involved in the assembly and testing itself.
This talk will give an overview over the ITk-pixel module building efforts and qualification measurements performed so far and also sketch the electrical tests performed in Göttingen.