Dortmund 2021 – scientific programme

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T: Fachverband Teilchenphysik

T 89: Pixel Detectors IV

T 89.7: Talk

Thursday, March 18, 2021, 17:30–17:45, Tn

Bump bond stress tests with ITk-Pixel-style daisy-chain modules through thermal cycling — •Steffen Korn, Jörn Grosse-Knetter, and Arnulf Quadt — II. Physikalisches Institut, Georg-August-Universität Göttingen

For the upgrade of the LHC to the HL-LHC, the Inner Detector will be replaced by the fully silicon-based Inner Tracker Detector (ITk). The pixel detector of the ITk uses hybrid modules where sensor and readout chips are connected by bump bonds. Early ITk module prototypes highlighted these bump bond connections as a possible point of failure in future ITk Pixel modules when exposed to thermally induced stress. In order to investigate this issue, daisy chain modules with realistic bump bond pitch and modules with read-out-chips were tested before and during exposure to thermal stress through cycling in a thermal shock chamber using a dedicated in-situ method in Goettingen. The results of these tests using different modules with different assembly options are presented in this talk.