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DS: Fachverband Dünne Schichten
DS 4: Poster
DS 4.17: Poster
Dienstag, 28. September 2021, 10:00–13:00, P
Characterizing ALD printed structures by imaging ellipsometry — •Peter H. Thiesen1, Ivan Kundrata2,3, Maksym Plakhotnyuk3, and Julien Bachmann2,3 — 1Accurion GmbH, Göttingen, Germany — 2FAU, Erlangen, Germany — 3ATLANT 3D, Lyngby, Dänemark
ATLANT 3D Nanosystems develops a disruptive 3D printing technology for micro and nano device rapid prototyping. The initial 3D printer prototype will be able to process oxides such as SiO2, TiO2, Al2O3, ZnO, and platinum with line width of 400 um. Later on, we will add processing of other materials, such as metals, sulfides, nitrides etc., also with a better selection of resolution down to 10 um. Thin film metrology of printed structures requires a fast measurement technique that is sensitive to thinnest films and offers a high lateral resolution also suited for the next development steps. Imaging Ellipsometry is an all-optical, non-contact metrology technique. It combines microscopic imaging with the measurement principles of spectroscopic ellipsometry and reaches a spatial resolution of about 1 micro meter. Ellipsometry is based on the samples interaction with polarized light and enables the characterization of ultra-thin films. The thickness of ALD-structures, printed at variable process parameters or with different materials was characterized by imaging ellipsometry. The standard characterization was done with a fixed angle of incidence system, equipped with a high power LED-HUB (SIMoN, EP4, Accurion GmbH) at an AOI of 60° and selected wavelength. Additionally, microscopic maps at different AOIs and wavelength of selected samples were recorded.