SKM 2021 – scientific programme

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HL: Fachverband Halbleiterphysik

HL 3: Poster Session I

HL 3.27: Poster

Monday, September 27, 2021, 10:00–13:00, P

Copper iodide thin films: Multistack AFM studies of local electrical properties — •Tillmann Stralka, Holger von Wenckstern, and Marius Grundmann — Solid State Physics, Leipzig, Germany

The search for high-performance p-type transparent conductive materials has been a major challenge for decades [1]. Copper iodide (CuI) or alloys based on CuI [2] could offer a solution, since CuI does outperform all other known p-type TCMs, concerning transmittance in the visible spectrum as well as electrical conductivity at room temperature [3]. In this contribution polycrystalline CuI thin films grown by sputtering, are investigated. Hereby we strive to understand and differentiate the contribution of grains and grain boundaries (GBs) to transport mechanisms. Topographic features as GBs lead to a depletion of majority charge carriers and even a localised inversion (two dimensional electron gas) within GBs [4]. To acquire morphological and electrical properties with a high spatial resolution we employ atomic force microscopy, which additionally offers current probe mode to characterise electrical properties. These measurements will be conducted and evaluated with a novel approach that offers voltage spectroscopy and localisation of nm sized objects at the same time furthermore correlate topographic features with electrical properties.

[1] M. Grundmann et al., J.Phys.D.Apps.Phys.,49(213001), 2016 [2] T.Jun et al., Adv. Mater. 30(1706573) [3] C.Yang et al., PNAS 113(412929) [4] M. Kneiß et al., Adv. Mater. Interfaces, 5(6), 2018