SAMOP 2023 – wissenschaftliches Programm
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Q: Fachverband Quantenoptik und Photonik
Q 43: QI Poster II (joint session QI/Q)
Q 43.42: Poster
Mittwoch, 8. März 2023, 16:30–19:00, Empore Lichthof
Packaging and Microfabrication Technology for Scalable Trapped Ion Quantum Computer — •Nila Krishnakumar1,2,3, Friederike Giebel1,2,3, Eike Iseke1,2,3, Konstantin Thronberens1,2,3, Jacob Stupp1,2,3, Amado Bautista-Salvador1,2,3, and Christian Ospelkaus1,2,3 — 1PTB, Bundesallee 100, 38116 Braunschweig, Germany — 2Leibniz Universität Hannover, Welfengarten 1, 30167 Hannover, Germany — 3LNQE, Schneiderberg 39, 30167 Hannover
Ion traps are a leading platform for scalable quantum computing. A physical implementation is based on microfabricated surface-electrode ion traps. A multilayer fabrication method [1] allows geometries which are impossible in single-layer traps. Thick and planarized dielectric-metal layers provide flexibility and better signal routing. The multilayer method requires microfabrication techniques such as UV Photolithography, Reactive Ion Etching(RIE), electroplating and more. Improving the efficiency and yield of the fabrication flow involves testing and updating each technology.
For scalability and hybrid integration of different control techniques, we discuss the implementation of TSVs (Through substrate vias) and better packaging technologies such as flip-chip bonding. As an alternative to the conventional wire bonding which limits the packaging density, a solder free thermocompression method proposed in [2] using gold stud bumps for flip-chip bonding is studied.
[1] A. Bautista-Salvador et al., New J. Phys. 21, 043011, Patent DE 10 2018 111 220 (2019)
[2] M. Usui et al.,(ICEP-IAAC) pp. 660-665 (2015)