DPG Phi
Verhandlungen
Verhandlungen
DPG

SAMOP 2023 – wissenschaftliches Programm

Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

Q: Fachverband Quantenoptik und Photonik

Q 59: Poster IV

Q 59.63: Poster

Donnerstag, 9. März 2023, 16:30–19:00, Empore Lichthof

Integration and coupling of quantum emitters in 2D materials to laserwritten waveguides — •Josefine Krause1, Simone Piacentini2, Mostafa Abasifard1, Roberto Osellame2, Giacomo Corrielli2, and Tobias Vogl1,31Institute of Applied Physics, Albert-Einstein-Str. 15, 07745 Jena, Germany — 2Istituto di Fotonica e Nanotecnologie, Consiglio Nazionale delle Ricerche (IFN-CNR), Piazza Leonardo da Vinci 32, 20133 Milano, Italy — 3Fraunhofer-Institute for Applied Optics and Precision Engineering IOF, Albert-Einstein-Str. 7, 07745 Jena, Germany

The practical application of quantum optics, for example in satellite-based quantum communication, requires the miniaturization of optical components into small devices. A hybrid solution is to integrate quantum emitters hosted in layered two-dimensional (2D) materials onto a photonic chip containing femtosecond laser-written waveguides. Emitters in 2D materials, such as hexagonal boron nitride, are suitable photon sources because of their high photon extraction efficiency due to the material's thinness. We demonstrate a deterministic transfer of an exfoliated tungsten disulfide emitter, employed as a test material for its bright fluorescence at room temperature, onto the front face of a waveguide through a viscoelastic stamping technique. The spectral emission properties of the integrated flake were maintained after the integration and coupling through the waveguide. Furthermore, with the goal of space-based applications, we successfully qualified different miniaturized photonic chips in their mechanical robustness during vibration and shock exposure imitating a rocket launch.

100% | Mobil-Ansicht | English Version | Kontakt/Impressum/Datenschutz
DPG-Physik > DPG-Verhandlungen > 2023 > SAMOP