SKM 2023 – scientific programme
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CPP: Fachverband Chemische Physik und Polymerphysik
CPP 44: Wetting, Fluidics and Liquids at Interfaces and Surfaces II (joint session CPP/DY)
CPP 44.8: Talk
Thursday, March 30, 2023, 11:30–11:45, MER 02
Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing — •Max Huber1,2,3, Xiao Hu1,2,3, Andreas Zienert1,2,3, and Jörg Schuster1,2,3 — 1Fraunhofer Institute for Electronic Nano Systems ENAS, Technologie-Campus 3, 09126 Chemnitz, Germany — 2Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Rosenbergstr. 6, 09126 Chemnitz, Germany — 3Center for Microtechnologies, Chemnitz University of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany
Thin liquid films play a crucial role for many applications, e.g., coating, particle deposition, wafer bonding, and the cooling of electronic devices. As an example, we investigate the evaporation of thin water films on LiTaO3. Ab initio density functional theory is used to calculate the Gibbs free energy of adsorption. These results are fitted to an expression of the Gibbs free energy which is derived from the disjoining pressure, consisting of molecular and structural components. In this way, the parameters for the disjoining pressure can be determined. A combination of literature-known models for spin drying and evaporation is used to analyze the temporal evolution of the water layer. The vapor above the water layer is modeled by diffusion and a mass balance is applied at the water-air interface. The results can be used to optimize the process time needed to reach the equilibrium thickness of the water layer. In addition, computational fluid dynamics simulations are utilized to investigate the evaporation in a wafer bond chamber during pump-down.