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DS: Fachverband Dünne Schichten

DS 10: Layer Properties II

DS 10.4: Talk

Wednesday, March 29, 2023, 11:45–12:00, SCH A 316

On the influence of the cation composition in reactively co-sputtered AgxCu1−xI thin films: Characterization of electrical, optical and structural properties — •Sofie Vogt, Christiane Dethloff, Jorrit Bredow, Tillmann Stralka, Holger von Wenckstern, and Marius Grundmann — Universität Leipzig, Felix-Bloch-Institut, Germany

CuI and its alloys are promising transparent p-type materials for complementary transparent devices. Polycrystalline thin films exhibit hole mobilities of about 19 cm2V−1s−1, which is comparable to the electron mobility of commercially used indium-gallium-zinc-oxide thin films[1,2]. It has been shown that alloying CuI with Ag leads to a transition from p-type material to n-type material for x≈ 0.5[3]. This paves the way for AgxCu1−xI/AgyCu1−yI based homojunction diodes. We present reactively co-sputtered AgxCu1−xI thin films in a range of 0.01 ≤ x ≤ 0.86. The thin films were deposited on glass substrates and crystallized in the γ-phase up to x≤ 0.67 and exhibit an additional AgI phase for higher Ag contents. An increase of the thin film resistivity from 2×10−4 Ωm to 30 Ωm was achieved by increasing the silver content from x=0.01 to x=0.67. All thin films are transparent in the visible light range and the expected decrease of the exciton binding energy up to x≈ 0.5 is observed, above which it remains constant.

[1] C. Yang et al., ACS Appl. Electr. Mater., 2, 3627-3632, 2020.
[2] S. Yang et al., IEEE Electron Device Lett., 32 (12), 1692-1694, 2011.
[3] A. Annadi et al., Appl. Mater. Today, 20, 100703, 2020.

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