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SKM 2023 – scientific programme

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MM: Fachverband Metall- und Materialphysik

MM 12: Poster I

MM 12.1: Poster

Monday, March 27, 2023, 18:15–20:00, P2/OG1+2

Time-of-Flight X-ray Photoelectron Microscopy (ToF-X-PEEM) — •G. Schönhense1, O. Tkach1,2, O. Fedchenko1, Y. Lytvynenko1, D. Vasilyev1, Q.L. Nguyen3, T.R.F. Peixoto4, A. Gloskovskii4, S. Chernov4, M. Hoesch4, N. Wind4,5, M. Heber4, C. Schlueter4, C. Sharma5, K. Rossnagel4,5, M. Scholz4, and H.-J. Elmers11Mainz Univ. — 2Sumy State Univ. — 3SLAC Nat. Accel. Lab., USA — 4DESY Hamburg — 5Kiel Univ.

The classical solution for photoelectron imaging in the X-ray range (X-PEEM) employs a hemispherical analyzer, as first described by Tonner1. X-PEEM shows reduced spatial and energy resolution and notoriously low transmission, a consequence of the slits and small angular acceptance of the hemisphere. ToF-X-PEEM combines time-of-flight energy recording with a new lens optics minimizing spherical aberration. Systematic ray tracings predict a resolution in the (sub-) micron range, when a k-confining aperture array is placed in the second reciprocal plane, where the k-magnification can be zoomed in a large range. The new optics has been recently commissioned at PETRA-III (soft X-rays), studying ultrathin flakes and Moiré sandwich patterns of various transition-metal dichalcogenides. We demonstrate the high quality of deposited flakes by systematic ToF-X-PEEM characterization. Imaging large field of view >3mm with widened X-ray beam profile enables rapid chemical mapping with frame rates up to 1/s for strong core levels. Contracting the beam spot to <20mu and placing it on the desired flake allows small-area SX-ARPES employing the momentum-microscopy mode. [1] B.Tonner, NIMS A291, 60(1990)

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