SKM 2023 – wissenschaftliches Programm

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O: Fachverband Oberflächenphysik

O 86: Solid-Liquid Interfaces II: Reactions and Electrochemistry I

O 86.10: Vortrag

Donnerstag, 30. März 2023, 17:30–17:45, TRE Phy

Cu Underpotential Deposition on Au(111) in Presence of Carboxylic Acids — •Sebastian Fackler, Markus Wittmann, Ludwig A. Kibler, and Timo Jacob — Ulm University, Institute of Electrochemistry, 89069 Ulm, Germany

The underpotential deposition (UPD) of foreign metals on different host metals has been extensively studied, especially for Cu on Au(111).[1] Apart from the nature of the metals, the nature and concentration of anions in the solution govern the initial stages of the deposition process. The influence is usually explained with respect to non-specific and specific adsorbing anions, with the ability of the latter to stabilize sub-monolayers of the deposited metal on the host metal by co-adsorption on top of well-ordered superstructures.[1]

Similarities and differences of the Cu UPD on Au(111) with short-chained carboxylic acids in comparison with known inorganic anions were systematically investigated by cyclic voltammetry and current transients. Despite the non-specifically adsorbing nature of perchlorate ions, the present study demonstrates that perchlorate can influence the Cu deposition in presence of specifically adsorbing acetate ions. Similarly, it has been found by in-situ STM studies that the presence of perchlorate influences the adsorption structure of strongly adsorbing formate on Au(111).[2]

[1] E. Herrero, et al., Chem. Rev. 2001, 101, 187-1930.

[2] A. Abdelrahman, Dissertation, Ulm University, 2019.