SMuK 2023 – scientific programme

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P: Fachverband Plasmaphysik

P 11: Poster I

P 11.12: Poster

Wednesday, March 22, 2023, 14:00–15:30, HSZ EG

Control of the angular distribution of incident ions by tailoring electromagnetic fields in the sheath region — •Elia Johannes Jüngling, Neil Unteregge, David Klute, Marc Böke, and Achim von Keudell — Experimental Physics II - Reactive Plasmas, Ruhr-University Bochum, Bochum, Germany

The angular distribution of ions impinging on a surface in contact with a plasma plays a key role in various applications like anisotropic plasma etching or glancing angle film growth for the fabrication of microstructure devices. Here, we investigate ways to influence and ultimately control the ion incident angle and the angular distribution of the impinging ions to enable a true 3d manufacturing of microstructure devices. The ion incident angle can be controlled by applying additional local electric and magnetic fields in the sheath region of a plasma. Here, the electric field is modified by including a grid system (mask) in front of the surface which can be either on the floating potential of the plasma or externally biased; a magnetic field parallel to the surface is introduced to induce an asymmetry in the angular distribution of incident ions. A combination of both methods has been tested for reactive ion etching of carbon films in an argon-oxygen plasma and for deposition of copper in a HIPIMS plasma. The resulting etching or deposition profiles have been compared with a 2d3v particle-in-cell code (PIC) to simulate the ion trajectories in the sheath region/mask region in front of the substrate surface. A very good agreement has been found.