SMuK 2023 – scientific programme
Parts | Days | Selection | Search | Updates | Downloads | Help
T: Fachverband Teilchenphysik
T 21: Si-Strips/CMS, Pixel/Sensor
T 21.1: Talk
Monday, March 20, 2023, 16:30–16:45, WIL/C307
Stress testing optical readout components for CMS 2S modules — Max Beckers2, •Christian Dziwok2, Lutz Feld1, Katja Klein1, Alexander Pauls1, Oliver Pooth2, Nicolas Röwert1, Martin Lipinski1, Vanessa Oppenländer1, Felix Thurn1, and Tim Ziemons2 — 1I. Physikalisches Institut B, RWTH Aachen University, D-52056 Aachen — 2III. Physikalisches Institut B, RWTH Aachen University
New detector modules will be installed for the upcoming CMS Phase-2 Outer Tracker upgrade. There are two general types of modules, one consisting of two co-planar silicon strip sensors (2S) and one of a macro pixel and a strip sensor (PS). The communication and the auxiliary support are supplied by a so-called SErvice Hybrid (SEH) in the case of a 2S module. It houses a two-stage DC-DC converter and a Low-Power Gigabit Transceiver (lpGBT). At the RWTH Aachen University, the SEHs are qualified regarding power and communication stability in a so-called test board setup, where the SEHs will undergo additional thermal cycling while being tested. A Field-Programmable Gate Array (FPGA) firmware was developed for the integrated testing routines, like a Bit Error Rate Testing (BERT) of the lpGBT's connections. This talk will focus on the data tests of this setup.