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CPP: Fachverband Chemische Physik und Polymerphysik
CPP 6: Composites and Functional Polymer Hybrids I
CPP 6.2: Talk
Monday, March 18, 2024, 12:00–12:15, H 0106
Effects of the particle packing structure on the thermal conductivity of filled polymer composites — •Oliver Roser1,2, Andreas Griesinger3, and Othmar Marti2 — 1Center for Heat Management (ZFW), Stuttgart — 2Institute of Experimental Physics, Ulm University — 3Baden-Wuerttemberg Cooperative State University (DHBW), Stuttgart
For a wide range of applications, polymers are modified with granular fillers to improve thermal conductivity. In addition to the filler concentration and the thermal properties of the polymer and fillers, it is predominantly the microscopic packing structure that affects the composite's achievable thermal conductivity. The attainable microscopic packing structure is dependent upon particle shape, size distribution, and agglomeration behavior, resulting in more or less effective thermal networks. For a detailed analysis of these effects, we have developed a new microscale modeling approach in which the filler packings are represented in geometric detail. Experimentally determined size distribution and shape data of the filler particles are used as input and enable the modeling of arbitrary filler materials. In this talk, we describe the new calculation strategy, the findings from the studies that have been performed on the microstructure of the filled polymer composites, and an experimental validation of the new calculation method.
Keywords: Effective Thermal Conductivity (ETC); Filler Packing Structure; Microscale Heat Conduction; Full-Field Simulation; Filled Polymers