Berlin 2024 – wissenschaftliches Programm

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DS: Fachverband Dünne Schichten

DS 15: Thermoelectric and Phase Change Materials

DS 15.4: Vortrag

Donnerstag, 21. März 2024, 11:15–11:30, A 060

An on-chip micro-thermoelectric temperature-controller — •Qun Jin, Kornelius Nielsch, and Heiko Reith — Institute for Metallic Materials, IFW Dresden, Dresden, Germany

To extend Moore's law in modern microelectronics, multidimensional nanoelectronic integration and multifunctional component assembly have been greatly explored in recent years. However, these approaches will inevitably make precise temperature control for temperature-sensitive electronic components a major challenge. Therefore, it is important to integrate thermoelectric (TE) films [1-2] into high-performance micro-on-chip temperature controllers.

Here, we report an approach to integrating our freestanding TE films into an on-chip micro-temperature controller for thermal energy management in power electronics [3]. It can achieve more energy-efficient temperature control than our previous TE coolers [4-5]. A cooling temperature exceeding 44.5 K can be achieved using only 445 μW, which is two orders of magnitude lower than that required in microheaters. In addition, our on-chip TE temperature controller shows an ultra-fast cooling rate exceeding 2,000 K/s and excellent reliability of up to 1 million cycles. Our micro temperature controller opens new avenues in developing modern electronics with numerous promising applications.

References: [1] Q. Jin, et al. Nature Materials, 18, 62-68 (2019). [2] Q. Jin, et al. Advanced Materials, 35, 2304751 (2023). [3] Q. Jin, et al. under revision in Nano-Micro Letters. [4] G. Li, et al. Nature Electronics. 1, 555-561 (2018). [5] Q. Zhang, et al. Nature Electronics. 5, 333-347 (2022).

Keywords: temperature control; temperature-sensitive component; temperature controller; freestanding thermoelectric film; low-power electronic