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HL: Fachverband Halbleiterphysik
HL 14: Poster II
HL 14.6: Poster
Montag, 18. März 2024, 15:00–18:00, Poster F
A Versatile Transfer Printing Toolbox for Device Stacking — •Ioannis Caltzidis1, Oscar Camacho Ibarra1, Normen Auler2, Jan G. Hartel1, Dirk Reuter2, and Klaus D. Jöns1 — 1PhoQS Institute, CeOPP, and Department of Physics, Paderborn University, Paderborn — 2Nanostructuring, Nanoanalysis and Photonic Materials, Department of Physics Paderborn University, Germany
To scale up photonic quantum technologies such as quantum communication, or quantum computing, integration in photonic circuits is required. One challenge is the efficient integration of single-photon emitters into photonic integrated circuits (PIC). The integration approaches of single photon emitters can be categorised into monolithic, heterogeneous and hybrid methods. Monolithic integration is the fastest in terms of fabrication overhead, while heterogeneous, and especially hybrid integration offers a diverse choice of materials and properties to be combined. Here we use molecular beam epitaxy-grown InxGa1-xAs/GaAs quantum dots integrated into a nanobeam cavity. The resulting nanophotonic device is transferred via a pick-and-place technique into a Lithium niobate on insulator (LNOI) waveguides which we fabricate using a triple-layer nanofabrication approach. We employ a thermal release transfer method with polypropylene carbonate as a release agent. The transfer stage's translational, rotational, and azimuthal degrees of freedom enable deterministic positioning and control in the fabrication process.
Keywords: Hybrid Integration; Integrated Photonics; Transfer Printing; Lithography