Berlin 2024 – scientific programme

Parts | Days | Selection | Search | Updates | Downloads | Help

MM: Fachverband Metall- und Materialphysik

MM 29: Poster II

MM 29.38: Poster

Tuesday, March 19, 2024, 17:00–19:00, Poster B

Interaction of reactive Fe-nanoparticles with the intermetallic compounds (IMC) layer during reflow soldering solidification — •Farzad Khodabakhshi^1,2, Irina Wodak¹, Andriy Yakymovych¹, Gerhard Wilde², and Golta Khatibi¹ — ¹Institute of Chemical Technologies and Analytics, Vienna University of Technology, Getreidemarkt 9/164, A-1060 Vienna, Austria — ²Institute of Materials Physics, University of Münster, Münster, 48149, Germany

As an innovative idea, reactive iron nanoparticles were applied at the interface between Sn-Ag solder alloy and copper substrates and mixed with the flux. To this end, the hindering effect of such nanoparticles against the intermetallic compound*s (IMC) layer growth during the reflow solidification in reactive soldering was revealed to be very significant in improving the functional performance of the solder joints. The leading focus of the present research is on the characterization of the interaction between the Fe-nanoparticles and the IMC layer using advanced microscopy techniques. In this case, the focused ion beam (FIB) technique was applied to prepare thinned lamellae from the head of the IMC layer interface with the solder joint area, followed by scanning transmission electron microscopy (STEM) observations and analyses of nano-scale precipitates through the IMC layer. Interestingly, the nano-scale features exhibited in situ phase transformations inside the Cu6Sn5 solder alloy layer due to iron diffusion and decomposition by solid/liquid edge migration and involved reactions.

Keywords: Reactive soldering; Intermetallic compounds (IMC) layer; Nano-scale precipitation; Advanced microscopy characterization; Sustainability