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MM: Fachverband Metall- und Materialphysik

MM 60: Topical Session: In Situ and Multimodal Microscopy in Materials Physics III

MM 60.7: Talk

Thursday, March 21, 2024, 17:30–17:45, C 130

Interdiffusion-controlled phase formation at an interconnect interface during soldering — •Sandra Gaertner, Sergiy V. Divinsky, and Gerhard Wilde — Institute of Materials Physics, University of Münster, Münster, Germany

Soldering is a long-standing technique to connect metal parts with a permanent bond. In this process often intermetallic compounds are formed. For the purpose of soldering, elements like Sn, Pb, Bi, Sb, Ag and Cu or their alloys are used in different compositions depending on the respective field of application. Changing environmental regulations towards lead-free solder increased the interest concerning Sn-based solder alloys. Yet, soldering of interconnects involves complex processes related to matter transport, phase stability and phase transformation kinetics. These fundamental processes might depend sensitively on local variations of the microstructure such as microstrain, dislocation accumulation, grain- and phase boundaries or voids. A rigorous analysis of the correlations between the process parameters, the resulting microstructure, the phase formation and the resulting performance necessitates detailed studies on multiple length scales. In the present work, the interdiffusion and diffusion-controlled phase formation processes in a Sn based solder alloy between a Ni based layer and a Cu substrate were investigated by quantitative scanning and transmission electron microscopy. The results are discussed with respect of the fundamental correlations between processing, defect structure and the resulting phase formation sequence.

Keywords: soldering; Sn-based solder; electron microscopy; intermetallic compounds