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QI: Fachverband Quanteninformation
QI 16: Superconducting Qubits (joint session QI/TT)
QI 16.2: Vortrag
Mittwoch, 20. März 2024, 09:45–10:00, HFT-FT 131
Enhanced parameter targeting in flip-chip geometry for large-scale superconducting quantum computing — •Léa Richard1,2, Agata Skoczylas1,2, Franziska Wilfinger1, Niklas Bruckmoser1,2, Leon Koch1,2, David Bunch1,2, Lasse Södergren1,2, and Stefan Filipp1,2 — 1Technical University of Munich, TUM School of Natural Sciences, Physics Department, 85748 Garching, Germany — 2Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching, Germany
In order to use quantum computing to tackle classically intractable problems, quantum processors must grow to larger scales. However, routing multiple control lines to an increasing number of qubits is not feasible in current superconducting planar architectures.
Using 3D-integration techniques, such as flip-chip bonding, plays a crucial role in mitigating this problem. A challenge arising from this new technology is the precise control of the vertical placement of the chips. In quantum circuits, capacitances and inductances are determined by the geometry of the electrodes. Hence, in a flip-chip assembly, it depends on the gap separating the two bonded chips. During the bonding process, variations may occur, preventing an accurate parameter targeting.
In this talk, we discuss the fabrication of thermally evaporated indium bumps and review the development of an optimized flip-chip bonding process. Moreover, we present a method for improved interchip spacing control and parameter targeting through the use of polymer spacers.
Keywords: Scaling; 3D integration; Flip chip bonding