Karlsruhe 2024 – scientific programme

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T: Fachverband Teilchenphysik

T 37: Silicon trackers 2

T 37.3: Talk

Tuesday, March 5, 2024, 16:30–16:45, Geb. 30.22: kl. HS B

Bump connectivity and efficiency studies on ATLAS ITkPix using a high intensity X-Ray beam — Yannick Dieter, Fabian Hügging, Hans Krüger, •Andreas Ulm, Marco Vogt, and Jochen Dingfelder — Physikalisches Institut der Universität Bonn

With the upgrade of the Large Hadron Collider (LHC), which will increase the instantaneous luminosity by a factor of approximately 5 to the current luminosity, the ATLAS detector will also be upgraded. In particular, a new all-silicon tracking detector (ATLAS ITk) is installed consisting of strip and hybrid pixel detectors.

Hybrid pixel detectors consist of a passive sensor element and an active readout chip which are connected via small solder bumps. As this interconnection is a quite complex process the bump connectivity of each pixel has to be tested. To test the bumps, a setup inside of an X-Ray machine has been installed. A X-ray machine is used to archive the high statistics needed to identify connected bumps in a short amount of time. In addition to that, the high intensity X-ray beam can also be used to investigate the rate capability of the ATLAS ITk pixel detector readout chip.

In this talk, a setup for the investigation of the bump-connectivity is presented and efficiency studies using a high intensity x-ray beam are shown.